At SION Semiconductors, we specialize in high-speed board design services that ensure your designs are optimized for the highest levels of performance and reliability.

Chip Design Services

Our expertise spans across various high-speed interfaces and technologies, making us a trusted partner for your design needs

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Comprehensive High-Speed Board Design, From Concept to Production

At SION Semi, we offer a complete suite of high-speed board design services.

From specification development to ensuring signal and power integrity, we cover every step to bring your high-speed designs to life.

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Board Specification Development and Consultation

Define precise board specifications that align with performance, compliance, and manufacturability requirements

  • Develop tailored specifications for high-speed applications, focusing on performance and compliance needs.

  • Consult on design trade-offs and provide optimization strategies to balance cost and performance.

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High-Speed Signal Routing and Optimization

Achieve excellent signal integrity and minimal crosstalk with advanced routing techniques tailored for high-speed boards.

  • Implement routing strategies that reduce interference and ensure controlled impedance and timing accuracy.

  • Use best practices to maintain signal quality and reliability in complex high-speed designs

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Impedance Control for High-Speed Interfaces (PCIe Gen5, DDR5, USB 3.2)

Ensure consistent impedance control for high-frequency signals to maintain signal integrity and meet compliance standards.

  • Validate impedance requirements and conduct simulations for critical high-speed interfaces to ensure compliance.

  • Mitigate signal degradation and maintain performance through precise impedance matching techniques.

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PCB Stack-Up and Layer Management

Design and manage stack-up and layer configurations to achieve optimal performance and manufacturability.

  • Optimize layer distribution to support signal integrity, high-density designs, and power delivery needs.

  • Plan and implement strategic stack-up configurations to achieve impedance control and EMI reduction.

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Component Selection and Procurement

Select and source components that meet the electrical and mechanical requirements of high-speed designs.

  • Choose components that balance high performance, availability, and cost efficiency for your designs.

  • Ensure component compatibility with overall design specifications, including power and thermal constraints.

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Power Integrity and Distribution Network Design

Design power distribution networks that provide stable and reliable power delivery across the board.

  • Implement power integrity techniques to minimize noise and optimize distribution paths for voltage stability.

  • Optimize power planes and decoupling strategies to achieve low impedance and efficient power delivery.

06

PCB Assembly and Manufacturing

Coordinate PCB assembly and manufacturing to ensure adherence to design specifications and high-quality standards.

  • Manage the entire manufacturing process, from prototype to production, ensuring compliance and quality.

  • Provide manufacturing support and oversight to ensure timely delivery of high-quality assemblies.

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Signal Integrity Analysis and Simulation

Use advanced simulation tools to predict and mitigate signal integrity issues before fabrication.

  • Perform pre-layout and post-layout simulations to identify and resolve potential signal issues.

  • Validate design parameters under various operating conditions to ensure robust performance.

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Prototyping and Testing for High-Speed Interfaces

Validate high-speed board designs through rigorous prototyping and testing to ensure performance and reliability.

  • Test high-speed interfaces for signal integrity and optimize designs based on test results.

  • Refine and validate designs under real-world conditions to ensure readiness for production.

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Thermal Management for High-Density Designs

Implement thermal management techniques to prevent overheating and ensure reliable performance.

  • Design for optimal thermal dissipation and predict potential thermal issues through simulations.

  • Implement effective cooling strategies to manage heat in high-power and high-density areas.

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Post-Layout Verification and Validation

Verify and validate PCB layouts to ensure compliance with electrical and mechanical specifications.

  • Conduct DRC and ERC checks to validate design accuracy against performance criteria and guidelines.

  • Perform extensive testing and verification to ensure designs meet electrical and mechanical standards.

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Design Rule Check (DRC) and Electrical Rule Check (ERC)

Ensure design integrity and compliance through rigorous rule checking processes.

  • Use DRC and ERC tools to identify and resolve potential layout and electrical issues in the design.

  • Ensure compliance with design guidelines and industry standards for manufacturability and functionality.

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Full-Scale Production and Manufacturing Support

Support the transition from prototype to production, ensuring seamless scaling and manufacturing.

  • Provide documentation and hands-on support to facilitate high-volume production scaling and quality assurance.

  • Work closely with manufacturers to maintain production quality, ensure consistency, and resolve issues swiftly.

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Ready to Discuss Your Chip Design Needs?

We are here to support your chip design journey. Reach out to our experts for guidance, technical consultation, or any inquiries you may have.

Let us help you turn your concepts into cutting-edge silicon solutions.